We are sell semiconductor

New Item Offer :

IC Items : For DMB Phone

1. CXA3235N-T4 : SONY : 56,000 Pieces, 1,000 Pieces/Reel : D/C: 05+ : Not Pb free

1. MB90F482PFV-G : Fujitsu : 11,000 Pieces, 960 Pieces/Tray, D/C:

03+ , Not Pb free

1. CL761STF : CORE LOGIC : 10,000 Pieces, 2,000 Pieces/Reel, D/C;

06+, Pb free

1. MSM6050-5TR : QUALCOMM : 500 Pieces, 500 Pieces/Reel, Pb FREE

2. TQM7M4022 : TRIQ : 2,500 Pieces, 2,500 Pieces. /DC; 04+, Pb free

LCD Panel of cellular Phone

1. 1.93 inch QQVGA MIKASA Chip(UPD161621P use): 29,655 Pieces

1. 1.8 inch QQVGA 12HR LDEI Cell, only : 28,500 Pieces

2. 2.03 inch ( 176*192 ) : 33,486 Pieces

1. 1.52 inch (128*128) chip ( HD66782 use or HD66782RBP use) : 132.255 Pieces

2. 1.31 inch QQVGA : 23.200 Pieces

1. 1.86 inch QQVGA Cell. Only : 29,000 Pieces

2. 1.9 inch QCIF chip( HD66772 use or HCD667B72RBP/774RBP use) :

485,810 Pieces

1. 1.9 inch QCIF chip(HD66789 use or HCD667B89RBP use) : 129,500 Pieces

2. 2.2 inch QCIF Cell, only : 50,461 Pieces

1. 2.22 inch QVGA RGB Chip(HD66781 use) : 12,800 Pieces

2. 1.76 inch QCIF +LDI chip(S6D0118A01-B0CX use) : 41,967 Piecees

1. 1.76 inch QCIF Cell, only : 160,446 Pieces

2. 1.98 inch QVGA ECB LDI Cell, only : 29,556 Pieces

1. 1.8 inch QCIF+LDI Cell, only : 178,000 Pieces

2. UF12R020A : SAMSUNG E330: 17,868 Pieces : MODULE

1. UG12D200A : 11,200 Pieces : MODULE

2. 2.0 inch TFT Panel : LH200Q02-A1 : 9,000 Pieces

1. 1.17 inch TFT Panel : LH117Q01-A1 : 9,000 Pieces

2. 2.0 QCIF CLASS : CMO ( CHI MEI ) : F020G1-T10 : 56,000 Pieces

1. 7 inch TFT PANEL : LT070W02-TMC2 : LG Philips : 10,000 Pieces

2. 1.8 inch GLASS : LB018Q01-B1 : 04+, 40,000 Pieces

1. 2.0 inch GLASS : LB020Q01-A1 : 04+ , 34,000 Pieces

LCD Drive Chip :

1. HD66773R : 120,000 Pieces

1. HD66789R : 8,888 Pieces

2. HD66741BP : 27,500 Pieces

1. HD66771 : 400,000 Pieces

2. HD66717 : 400,000 Pieces

1. HX8310A : HIMAX : 10,480 Pieces

2. HCD667B73RBSMV : 1,996 Pieces

1. HCD667A66RBP : 40,000 Pieces

2. HCD667A66UBP : 100,000 Pieces

1. HCD66781S : 100,000 Pieces

2. HD66783BP : 100,000 Pieces

1. HD66781S : 100,000 Pieces

MCP IC For Cellular Phone

1. TV00670003CAGB : 128M Nor Flash and 64 M SRAM : TOSHIBA : D/C; 95+

100,000 Pieces, Lead Free , with same TH50VPF6783AASB :

if you are interest in this parts, We can support DataSheet

1. Qualcomm Chip :

1) MSM6050-4TR : 30,000 Pieces ,D/C: 05+

2) RFR6000 : : 30,000 Pieces ,D/C: 05+

3) RFL6000, : : 30,000 Pieces ,D/C: 05+

4) RFT6100 : 30,000 Pieces ,D/C: 05+

5) MSM5105 : 10,000 Pieces, D/C: 05+

6) MSM6000 : 70,000 Pieces, D/C: 05+

7) MSM6100 : 21,000 Pieces, D/C: 04+

8) MSM3300 : 45,000 Pieces, D/C: 02+

9) MSM3100 : 55,000 Pieces

10) MSM3000 : 20,000 Pieces

1. MEMORY : LH28F128BFHD-PWTLZ1 : SHARP : 62,000 Pieces

2. MCP of Cellular Phone :

1) AM41DL3224GT ?85I : 35,000 Pieces, D/C: 04+

2) AM41DL3224GT-70I : 115,000 Pieces, D/C: 04+

3) AM49DL6408H70I, S71JL064H80BAW11X : 83,000 Pieces , D/C: 04+

4) LRS1830 : SHARP : 34,000 Pieces, D/C: 03+

5) LRS1830A : SHARP : 60,000 Pieces

FROM TAEJON ELECTRONICS LEE JAE KYUNG in KOREA TEL : 82-42-532-6747 FAX : 82-42-532-6748 E-mail : snipped-for-privacy@kornet.net